Encapsulant and Wire Bond Adhesive with Secondary Heat Cure

Multi-Cure^® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulation applications – for chip on glass, chip on board, or chip on flex – as well as many wire bonding applications. 9037-F cures under broad-spectrum UV/Visible light, but also includes secondary heat cure to address applications where shadow areas are present. The encapsulant has great flexibility and provides high moisture as well as thermal resistance. It also fluoresces blue when exposed to black light, allowing for easy inspection.