9200 W Series Adhesives Encapsulants 9211 W

Low-Stress Plastic Bonding Adhesive for Camera Module Assembly

9211-W low-stress plastic bonding adhesive cures with UV/Visible light energy for ultra-fast bonding and sealing of camera module components found in consumer wearable devices.

This product forms excellent bonds to PC, LCP, ABS, and FR4 substrates and is specifically designed for CCM applications and camera module barrel fixtures.

Solvent-free, one-component, and RoHS compliant, 9211-W is a plastic bonding adhesive formulated without IBOA and with low-sensitizing ingredients to be as safe as possible when wearables are touching or close to the skin.

9211-W adhesive is in full compliance with RoHS directives 2015/863/EU.

For medical wearables assembly, see the Dymax 2000-MW series of biocompatible IBOA- and TPO-free adhesives.


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